FBM1808 Key Features
- Excellent solderability and high heat resistance for either flow or reflow soldering
- A closed circuit formed by internal silver printed layer, acting like a magn
- Part: FBM1808
- Manufacturer: HITANO
- Size: 219.74 KB
Related HITANO Datasheets
| Part Number | Description |
|---|---|
| FBM1812 | Multilayer Chip Bead |
| FBM1204 | Multilayer Chip Bead |
| FBM1206 | Multilayer Chip Bead |
| FBM1210 | Multilayer Chip Bead |
| FBM0402 | Multilayer Chip Bead |
FBM1808 Description
Page HITANO ENTERPRISE CORP. 3, Wu Chuan 1st Road, New Taipei Industrial Park, New Taipei City, TAIWAN, R.O.C. +886 2 2299 1331 (Rep.) Fax:.