HITANO ENTERPRISE CORP.
MMSZ5221B THRU MMSZ5259B
TECHNICAL SPECIFICATIONS OF SURFACE MOUNT SILICON ZENER DIODES
FEATURES
* Planar Die construction
* Zener Voltages from 2.4V - 39V
* 500mW Power Dissipation
* Ideally Suited for Automated Assembly
Processes
SOD-123
MECHANICAL DATA
* Case: Molded Plastic
* Terminals:Solder plated, solderable per
MIL-STD-202, Method 208
* Polarity: See Diagram Below
* Mounting position: Any
* Weight: 0.008 gram Approx.
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
Ratings at 25 oC ambient temperature unless otherwise specified.
Single phase, half wave, 60 Hz, resistive or inductive load.
For capacitive load, derate current by 20%.
.028(0.7)
.019(0.5)
.154(3.9)
.141(3.6)
.110(2.8)
.098(2.5)
.071(1.8)
.055(1.4)
.008
(0.2)
MAX.
.005
(0.12)
MAX.
.053(1.4)
.037(1.0)
.016
(0.4)
MIN.
Dimensions in inches(millimeters)
Zener Current see Table "Characteristics"
Power Dissipation (Notes 1) at Tamb=25oC
Peak Forward Surge Current, 8.3ms single half sine-wave
superimposed on rated load (JEDEC Method) (Notes 2)
Maximum Forward Voltage at IF=100mA
Operating and Storage Temperature
SYMBOL
Ptot
IFSM
VF
TJ,Tstg
VALUE
500
4.0
1.2
-55 to + 150
Notes: 1. Mounted on 5.0mm2 (.013mm thick) land areas.
2. Measured on 8.3ms, single half sine-wave or equivalent square wave, duty cycle = 4 pulses per minute maximum.
UNITS
mW
Amps
Volts
oC