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BZX84C11 - Plastic-Encapsulate Diodes

This page provides the datasheet information for the BZX84C11, a member of the BZX84C2V4 Plastic-Encapsulate Diodes family.

Datasheet Summary

Features

  • Planar Die Construction. 350mW Power Dissipation Zener Voltages From 2.4V - 39V Ideally Suited For Automated Assembly Prcesses Plastic-Encapsulate Diodes BZX84C series SOT-23 Maximum Ratings (TA=25 unless otherwise noted) Characteristic Symbol Forward Voltage (Note 2) @ IF = 10mA VF Power Dissipation(Note 1) PD Thermal Resistance, Junction to Ambient Air RθJ Operating and Storage Temperature Range Tj,TST Notes: 1. Device mounted on ceramic PCB: 7.6mm x 9.4mm x 0.87mm with pad areas.

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Datasheet Details

Part number BZX84C11
Manufacturer HOTTECH
File Size 281.25 KB
Description Plastic-Encapsulate Diodes
Datasheet download datasheet BZX84C11 Datasheet
Additional preview pages of the BZX84C11 datasheet.

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Full PDF Text Transcription

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ZENER DIODES FEATURES Planar Die Construction. 350mW Power Dissipation Zener Voltages From 2.4V - 39V Ideally Suited For Automated Assembly Prcesses Plastic-Encapsulate Diodes BZX84C series SOT-23 Maximum Ratings (TA=25 unless otherwise noted) Characteristic Symbol Forward Voltage (Note 2) @ IF = 10mA VF Power Dissipation(Note 1) PD Thermal Resistance, Junction to Ambient Air RθJ Operating and Storage Temperature Range Tj,TST Notes: 1. Device mounted on ceramic PCB: 7.6mm x 9.4mm x 0.87mm with pad areas 25mm2 self-heating effect 3. f=1KHZ Value Unit 0.9 V 350 mW 357 /W -65~ +150 2. Short duration test pulse used to minimize GUANGDONG HOTTECH INDUSTRIAL CO,. LTD.
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