surface mount flip chip leds.
* Improved Reliability Through Elimination of Internal Wire Bond
* -40 to 85°C Operating Temperature Range
* Small Size
* Industry Standard Footprint
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* Keypad Backlighting
* LCD Backlighting
* Symbol Backlighting
* Front Panel Indicator
Description
The .
The HSMX-H670 and HSMX-H690 introduce a revolutionary concept to the world of LEDs. The internal flip chip construction eliminates the wire bond between the chip and printed circuit board. Consequently as a result of the robust construction, product .
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