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HCPL-0561 - (HCPL-0560 / HCPL-0561) Dual Channel Bi-directional High Speed Optoisolators

Download the HCPL-0561 datasheet PDF (HCPL-0560_Hewlett included). The manufacturer datasheet provides complete specifications, pinout details, electrical characteristics, and typical applications for (hcpl-0560 / hcpl-0561) dual channel bi-directional high speed optoisolators.

Description

These bi-directional dual channel optoisolators, packaged in an industry standard SOIC-8 package, provide full duplex and bi-directional isolated data transfer and communication capability in a compact surface mount package.

Features

  • Bi-directional Configurations in SOIC-8 Package.
  • Available Configurations: VCC Common: HCPL-0560 Ground Common: HCPL-0561.
  • High Speed: 1 MBd.
  • TTL Compatible.
  • Open Collector Output Stage.
  • Performance Guaranteed over 0˚C to +70˚C Temperature Range.
  • Safety Approval UL Recognized per UL1577 for 2500 Vrms/1 min. CSA Approved.

📥 Download Datasheet

Note: The manufacturer provides a single datasheet file (HCPL-0560_Hewlett-Packard.pdf) that lists specifications for multiple related part numbers.

Datasheet Details

Part number HCPL-0561
Manufacturer Hewlett-Packard
File Size 232.57 KB
Description (HCPL-0560 / HCPL-0561) Dual Channel Bi-directional High Speed Optoisolators
Datasheet download datasheet HCPL-0561 Datasheet
Other Datasheets by Hewlett-Packard

Full PDF Text Transcription

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www.DataSheet4U.com Dual Channel Bi-directional High Speed Optoisolators Technical Data HCPL-0560 HCPL-0561 Features • Bi-directional Configurations in SOIC-8 Package • Available Configurations: VCC Common: HCPL-0560 Ground Common: HCPL-0561 • High Speed: 1 MBd • TTL Compatible • Open Collector Output Stage • Performance Guaranteed over 0˚C to +70˚C Temperature Range • Safety Approval UL Recognized per UL1577 for 2500 Vrms/1 min. CSA Approved Description These bi-directional dual channel optoisolators, packaged in an industry standard SOIC-8 package, provide full duplex and bi-directional isolated data transfer and communication capability in a compact surface mount package.
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