Datasheet Summary
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Agilent HMPP-386x Series MiniPak Surface Mount RF PIN Diodes
Data Sheet
Features
- Surface mount MiniPak package
- low height, 0.7 mm (0.028") max.
- small footprint, 1.75 mm2 (0.0028␣ inch2)
- Better thermal conductivity for higher power dissipation Description/Applications These ultra-miniature products represent the blending of Agilent Technologies’ proven semiconductor and the latest in leadless packaging technology. The HMPP-386x series of general purpose PIN diodes are designed for two classes of applications. The first is attenuators where current consumption is the most important design consideration. The second application for this series of diodes is in...