Note: Hxsemi lead-free products contain molding compounds/die attach materials and 100% matte tin plate termination finish; which are fully compliant with RoHS.
Full PDF Text Transcription for HX3400 (Reference)
Note: Below is a high-fidelity text extraction (approx. 800 characters) for
HX3400. For precise diagrams, and layout, please refer to the original PDF.
ON) =28mΩ(Typ.) @ VGS=4.5V RDS(ON) =42mΩ(Typ.) @ VGS=2.5V Super High Dense Cell Design Reliable and Rugged Lead Free and Green Devices Available (RoHS Compliant) Applications Power Management in Notebook Battery Powered System DC/DC Converter Load Switch DSC LCD Display inverter Ordering and Marking Information Pin Description Note: Hxsemi lead-free products contain molding compounds/die attach materials and 100% matte tin plate termination finish; which are fully compliant with RoHS. Hxsemi lead-free products meet or exceed the lead-free requirements of IPC/JEDEC J-STD-020C for MSL classification at lead
HX3400 Datasheet
