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MCR89-130D-DC - Socket for Memory Module Board

Features

  • 1. High Reliability This socket achieves high reliability in the horizontal contact spring system. 4. Miniature Type and High Density Mounting The low profile with 6.2mm height from the board is suitable for miniaturization of equipment. The 1.27mm pitch between contacts assures mounting with high density. 2. Low Insertion Force This socket prevents mis-insertion force in the preload structure. 5. Wide Effective Mounting Area This socket is capable of widening the effective mounting area on t.

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Datasheet preview – MCR89-130D-DC

Datasheet Details

Part number MCR89-130D-DC
Manufacturer Hirose Electric
File Size 135.91 KB
Description Socket for Memory Module Board
Datasheet download datasheet MCR89-130D-DC Datasheet
Additional preview pages of the MCR89-130D-DC datasheet.

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Full PDF Text Transcription

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Socket for Memory Module Board MCR89 Series FEM Design Simulation Designed in Miniature 2 Contacts with High Precision Spring sFeatures 1. High Reliability This socket achieves high reliability in the horizontal contact spring system. 4. Miniature Type and High Density Mounting The low profile with 6.2mm height from the board is suitable for miniaturization of equipment. The 1.27mm pitch between contacts assures mounting with high density. 2. Low Insertion Force This socket prevents mis-insertion force in the preload structure. 5. Wide Effective Mounting Area This socket is capable of widening the effective mounting area on the module printed board, and secures retention function by easy locking. 3. Easy Pattern Design The dip contact through-hole diameter is only Ø0.
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