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H5TQ2G83DFR-xxI Datasheet

Manufacturer: SK Hynix

This datasheet includes multiple variants, all published together in a single manufacturer document.

H5TQ2G83DFR-xxI datasheet preview

Datasheet Details

Part number H5TQ2G83DFR-xxI
Datasheet H5TQ2G83DFR-xxI H5TQ2G83DFR-xxC Datasheet (PDF)
File Size 333.13 KB
Manufacturer SK Hynix
Description 2Gb DDR3 SDRAM
H5TQ2G83DFR-xxI page 2 H5TQ2G83DFR-xxI page 3

H5TQ2G83DFR-xxI Overview

tions which requires large memory density and high bandwidth. Hynix 2Gb DDR3 SDRAMs offer fully synchronous operations referenced to both rising and falling edges of the clock. While all addresses and control inputs are latched on the rising edges of the CK (falling edges of the CK), Data, Data strobes and Write data masks inputs are sampled on both rising and falling edges of it.

H5TQ2G83DFR-xxI Key Features

  • VDD=VDDQ=1.5V +/- 0.075V
  • Fully differential clock inputs (CK, CK) operation
  • Differential Data Strobe (DQS, DQS)
  • On chip DLL align DQ, DQS and DQS transition with CK transition
  • DM masks write data-in at the both rising and falling edges of the data strobe
  • All addresses and control inputs except data, data strobes and data masks latched on the rising edges of the clock
  • Programmable additive latency 0, CL-1, and CL-2 supported
  • Programmable CAS Write latency (CWL) = 5, 6, 7, 8
  • Programmable burst length 4/8 with both nibble sequential and interleave mode
  • BL switch on the fly
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