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H9TP32A4GDBCPR Datasheet 4GB eNAND (x8) / LPDDR2-S4B 4Gb(x32)

Manufacturer: SK Hynix

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General Description

and is subject to change without notice.

SK hynix does not assume any responsibility for use of circuits described.

No patent licenses are implied.

Overview

CI-MCP Specification 4GB eNAND (x8) + 4Gb LPDDR2-S4B (x32) This document is a general.

Key Features

  • [ CI-MCP ].
  • Operation Temperature - (-25)oC ~ 85oC.
  • Package - 162-ball FBGA - 11.5x13.0mm2, 1.0t, 0.5mm pitch - Lead & Halogen Free [ e-NAND ] [ LPDDR2 S4B ].
  • Packaged NAND flash memory with MultiMediaCard interface.
  • e-NAND system specification, compliant with V4.41.
  • Full backward compatibility with previous eNAND system specification.
  • Bus mode - High-speed eMMC protocol. - Three different data bus widths: 1 bit, 4 bits,8 bits. - Data transfer rate: up to 104Mby.

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