HMP525F7FFP4C-xx Datasheet PDF (240pin Fully Buffered DDR2 SDRAM DIMMs) | Download Hynix Semiconductor HMP525F7FFP4C-xx

HMP525F7FFP4C-xx - 240pin Fully Buffered DDR2 SDRAM DIMMs

Download the HMP525F7FFP4C-xx datasheet PDF (HMP564F7FFP8C included). The manufacturer datasheet provides complete specifications, pinout details, electrical characteristics, and typical applications for 240pin fully buffered ddr2 sdram dimms.

Description

and is subject to change without notice.

Hynix Semiconductor does not assume any responsibility for use of circuits described.

No patent licenses are implied.

Features

novel architecture including the Advanced Memory Buffer that isolates the DDR2 SDRAMs from the channel. This single component located in the front side center of each DIMM, acts as a repeater and buffer for all signals and commands which are exchanged between the host controller and the DDR2 SDRAMs including data in and output. The AMB communicates with the host controller and adjacent DIMMs on a system board using an industry standard Differential Point to Point Link Interface at 1.5V power. Th.

Datasheet Details

Part number	HMP525F7FFP4C-xx
Manufacturer	SK Hynix
File Size	669.49 KB
Description	240pin Fully Buffered DDR2 SDRAM DIMMs
Datasheet	HMP525F7FFP4C-xx Datasheet

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Full PDF Text Transcription

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www.DataSheet4U.net 240pin Fully Buffered DDR2 SDRAM DIMMs based on 512 Mb F-ver. This Hynix’s Fully Buffered DIMM is a high-bandwidth & large capacity channel solution that has a narrow host interface. Hynix’s FB-DIMM features novel architecture including the Advanced Memory Buffer that isolates the DDR2 SDRAMs from the channel. This single component located in the front side center of each DIMM, acts as a repeater and buffer for all signals and commands which are exchanged between the host controller and the DDR2 SDRAMs including data in and output. The AMB communicates with the host controller and adjacent DIMMs on a system board using an industry standard Differential Point to Point Link Interface at 1.5V power.

Published: Sep 5, 2011 |