P9225-R Datasheet
Contents
1. Pin Assignments...........................................................................................................................................................................................5
2. Pin Descriptions............................................................................................................................................................................................6
3. Absolute Maximum Ratings..........................................................................................................................................................................8
4. Thermal Characteristics................................................................................................................................................................................9
5. Electrical Characteristics ..............................................................................................................................................................................9
6. Typical Performance Characteristics..........................................................................................................................................................12
7. Functional Block Diagram...........................................................................................................................................................................15
8. Theory of Operation....................................................................................................................................................................................16
8.1 LDO – Low Dropout Regulators ........................................................................................................................................................16
8.2 Setting the Output Voltage – VOSET ................................................................................................................................................16
8.3 SINK Pin............................................................................................................................................................................................17
8.4 Rectifier Voltage – VRECT ................................................................................................................................................................17
8.5 Over-Current Limit – ILIM ..................................................................................................................................................................17
8.6 Interrupt Function – INT.....................................................................................................................................................................17
8.7 Enable Pin – EN ................................................................................................................................................................................18
8.8 Thermal Protection ............................................................................................................................................................................18
8.9 External Temperature Sensing – TS .................................................................................................................................................18
8.10 End of Charge – EOC........................................................................................................................................................................18
8.11 Received Power Packet Offset and Gain Calibration – RPPO and RPPG........................................................................................18
8.12 Advanced Foreign Object Detection (FOD).......................................................................................................................................19
9. Communication Interface............................................................................................................................................................................20
9.1 Modulation/Communication ...............................................................................................................................................................20
9.2 Byte Encoding for ASK ......................................................................................................................................................................20
9.3 Packet Structure ................................................................................................................................................................................20
10. WPC Mode Characteristics ........................................................................................................................................................................21
10.1 Selection Phase or Startup................................................................................................................................................................21
10.2 Ping Phase (Digital Ping)...................................................................................................................................................................22
10.3 Identification and Configuration Phase..............................................................................................................................................22
10.4 Power Transfer Phase.......................................................................................................................................................................22
11. Functional Registers...................................................................................................................................................................................23
12. I2C Access Description ..............................................................................................................................................................................28
13. Application Information ...............................................................................................................................................................................29
13.1 Power Dissipation and Thermal Requirements .................................................................................................................................29
13.2 Recommended Coils .........................................................................................................................................................................30
13.3 Typical Application Schematic...........................................................................................................................................................31
13.4 Bill of Materials (BOM).......................................................................................................................................................................32
14. Package Outline Drawings .........................................................................................................................................................................33
15. Special Notes: WLCSP-52 (AHG52) Package Assembly...........................................................................................................................33
© 2018 Integrated Device Technology, Inc.
2
November 12, 2018
