...2 Package and Pin Diagrams ...2 Typical Application Circuit and Waveforms 3 Evaluation Modules ......3 Key Parameters by Order Number ..4 Operation Theory .........5 A.

Can be parallel connected to increase the current drive capability. Chip-on-board process available. Applications AC LE.

.....2 Features ...2 Package and Pin Diagrams ...2 Typical Application Circuit and Waveforms 3 Evaluation Modules ......3 Key Parameters by Order Number ..4 Operation Theory .........5 Application Information 9 8.1 8.2 8.3 8.4 8.5 8.6 Selection of Dr.

iML8683

IML10

IMLT65R015M2H

IMLT65R020M2H

IMLT65R040M2H

IMLT65R050M2H

IMLT65R060M2H

IM00GR

IM00JR

IM00NS

IM00TS

IM01CGR

IM01CTS