CCM04-xxx
Overview
- 1 Fig. 7
- 2 28 Fig. 8
- 1 22.10
- 6 17.0
- 6 11.18
- 8 10.16 MK II: Developed to interface with SIM/SAM cards as defined by GSM11-11 and ENV1375-1. Available with either hinged covers or fixed covers and have been designed to minimize the amount of space needed for PCB mounting. The high temperature thermoplastic moldings are suited for infrared and convection soldering processes. MK III: SIM/SAM card connector features an integrated card detection switch providing a competitive advantage to smart card reader device manufacturers by minimizing the space usage on the PCB, and features a side entry to
