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X3-Class HiPerFETTM Power MOSFET
N-Channel Enhancement Mode Avalanche Rated
IXFA130N15X3
D G
S
Symbol
VDSS VDGR
VGSS VGSM
ID25 IL(RMS) IDM
IA EAS
dv/dt
PD
TJ TJM Tstg
TL dT/dt TSOLD
FC Weight
Test Conditions TJ = 25C to 150C TJ = 25C to 150C, RGS = 1M Continuous Transient
Maximum Ratings
150
V
150
V
20
V
30
V
TC = 25C (Chip Capability) External Lead Current Limit TC = 25C, Pulse Width Limited by TJM
TC = 25C TC = 25C
IS IDM, VDD VDSS, TJ 150°C
TC = 25C
130 120 230
65 1.2
50
390
-55 ... +150 150
-55 ... +150
A A A
A J
V/ns
W
C C C
Maximum Lead Temperature for Soldering Heating / Cooling rate, 175C - 210C
1.6 mm (0.062in.) from Case for 10s
300
°C
50
°C/min
260
°C
Mounting Force
10..65 / 2.2..14.6
N/lb
2.