Silicon Chip on Direct-Copper Bond (DCB) Substrate Isolated Mounting Surface 4000V Electrical Isolation High Peak Current Capability Low Saturation Voltage Molding Epoxie.

( Electrically Isolated Tab) IXGF30N400 VCES = 4000V = 30A IC25 VCE(sat) ≤ 3.1V ISOPLUS i4-PakTM Symbol VCES VGES VGE.

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