IXGF30N400 Key Features
- Silicon Chip on Direct-Copper Bond (DCB) Substrate
- Isolated Mounting Surface
- 4000V Electrical Isolation
- High Peak Current Capability
- Low Saturation Voltage
- Molding Epoxies Meet UL 94 V-0
- High Power Density -Easy to Mount
- Part: IXGF30N400
- Manufacturer: IXYS (official site)
- Size: 730.39 KB
Related IXYS Datasheets
| Part Number | Description |
|---|---|
| IXGF32N170 | High Voltage IGBT |
| IXGF36N300 | High Voltage IGBT |
| IXGF20N250 | High Voltage IGBT |
| IXGF20N300 | High Voltage IGBT |
| IXGF25N250 | High Voltage IGBT |
IXGF30N400 Description
+150 °C Maximum Lead Temperature for Soldering 1.6 mm (0.062in.) from Case for 10s 300 °C 260 °C Mounting Force 20..120 / 4.5..27 Nm/lb.in.