IXYP20N65C3D1M - Extreme Light Punch Through IGBT

Features

Optimized for 20-60kHz Switching.
Plastic Overmolded Tab for Electrical Isolation.
Square RBSOA.
Avalanche Rated.
Anti-Parallel Fast Diode.
Short Circuit Capability.
2500V~ Electrical Isolation.
International Standard Package Advantages.
High Power Density.
Extremely Rugged.
Low Gate Drive Requirement Symbol Test Conditions (TJ = 25C, Unless Otherwise Specified) BVCES IC = 250A, VGE = 0V VGE(th) IC = 250A, VCE = VGE ICES VCE = V.

IXYP20N65C3D1M Extreme Light Punch Through IGBT by IXYS - Datasheet Preview — Datasheet preview – IXYP20N65C3D1M

Datasheet Details

Part number	IXYP20N65C3D1M
Manufacturer	IXYS (now Littelfuse)
File Size	259.97 KB
Description	Extreme Light Punch Through IGBT
Datasheet	IXYP20N65C3D1M Datasheet
Additional preview pages of the IXYP20N65C3D1M datasheet.

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Full PDF Text Transcription

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Preliminary Technical Information XPTTM 650V IGBT GenX3TM w/Diode (Electrically Isolated Tab) IXYP20N65C3D1M Extreme Light Punch Through IGBT for 20-60 kHz Switching Symbol VCES VCGR VGES VGEM IC25 IC110 IF110 ICM IA EAS SSOA (RBSOA) tsc (SCSOA) PC TJ TJM Tstg TL TSOLD VISOL Md Weight Test Conditions TJ = 25°C to 175°C TJ = 25°C to 175°C, RGE = 1M Continuous Transient TC = 25°C TC = 110°C TC = 110°C TC = 25°C, 1ms TC = 25°C TC = 25°C VGE = 15V, TVJ = 150°C, RG = 20 Clamped Inductive Load VGE = 15V, VCE = 360V, TJ = 150°C RG = 82, Non Repetitive TC = 25°C Maximum Lead Temperature for Soldering 1.6 mm (0.062in.

Published: Jul 20, 2016 |