IXYS MIXA600CF650TSF
XPT IGBT
FEATURES
/ Advantages:● High level of integration - only one power semiconductor module required for the whole drive
● Rugged XPT design (Xtreme light Punch Through) results in: - short circuit rated for 10 µsec. - very low gate charge - low EMI - square RBSOA @ 3x Ic
● Thin wafer technology combined with the XPT design results in a competitive low VCE(sat)
● Temperature sense included
● SONIC™ diode - fast and soft reverse recovery - low operating forward voltage
APPLICATIONS
:● AC motor drives
● Pumps, Fans
● Washing machines
● Air-conditioning system
● Inverter and power supplies Package: SimBus F
● Isolation Voltage: 3000 V~
● Industry standard outline
● RoHS compliant
● Soldering pins for PCB mounting
● Height: 17 mm
● Base plate: Copper internally DCB isolated
● Advanced power cycling IXYS reserves the right to change limits, conditions and dimensions. © 2012 IXYS all rights reserved Data according to IEC 60747and per semiconductor unless otherwise specified 20121107 IGBT Symbol VCES VGES VGEM I C25 I C80 Ptot VCE(sat) Definition collector emitter voltage max.