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XBB170 - Relay

General Description

XBB170 is a

Key Features

  • 3750Vrms Input/Output Isolation.
  • Low Drive Power Requirements (TTL/CMOS Compatible).
  • High Reliability.
  • Arc-Free With No Snubbing Circuits.
  • FCC Compatible.
  • VDE Compatible.
  • No EMI/RFI Generation.
  • Small 8-Pin Package.
  • Machine Insertable, Wave Solderable.
  • Surface Mount, Tape & Reel Version Available.

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Full PDF Text Transcription (Reference)

The following content is an automatically extracted verbatim text from the original manufacturer datasheet and is provided for reference purposes only.

View original datasheet text
INTEGRATED CIRCUITS DIVISION XBB170 Dual Single-Pole, Normally Closed OptoMOS® Relay Parameter Blocking Voltage Load Current On-Resistance (max) Ratings 350 100 50 Units VP mArms / mADC  Features • 3750Vrms Input/Output Isolation • Low Drive Power Requirements (TTL/CMOS Compatible) • High Reliability • Arc-Free With No Snubbing Circuits • FCC Compatible • VDE Compatible • No EMI/RFI Generation • Small 8-Pin Package • Machine Insertable, Wave Solderable • Surface Mount, Tape & Reel Version Available Applications • Telecommunications • Telecom Switching • Tip/Ring Circuits • Modem Switching (Laptop, Notebook, Pocket Size) • Hook Switch • Dial Pulsing • Ground Start • Ringing Injection • Instrumentation • Multiplexers • Data Acquisition • Electronic Switching • I/O Subsystems • Meters (