Datasheet4U Logo Datasheet4U.com

32N50Q - IXFR32N50Q

Datasheet Summary

Features

  • Silicon chip on Direct-Copper-Bond substrate - High power dissipation - Isolated mounting surface - 2500V electrical isolation.
  • Low drain to tab capacitance(.

📥 Download Datasheet

Datasheet preview – 32N50Q

Datasheet Details

Part number 32N50Q
Manufacturer IXYS Corporation
File Size 119.22 KB
Description IXFR32N50Q
Datasheet download datasheet 32N50Q Datasheet
Additional preview pages of the 32N50Q datasheet.
Other Datasheets by IXYS Corporation

Full PDF Text Transcription

Click to expand full text
www.DataSheet4U.com HiPerFETTM Power MOSFETs ISOPLUS247TM (Electrically Isolated Back Surface) N-Channel Enhancement Mode High dV/dt, Low trr, HDMOSTM Family Preliminary data Symbol VDSS VDGR VGS VGSM ID25 IDM IAR EAS EAR dv/dt PD TJ TJM Tstg TL VISOL Weight 1.6 mm (0.062 in.) from case for 10 s 50/60 Hz, RMS t = 1 minute leads-to-tab Test Conditions TJ = 25°C to 150°C TJ = 25°C to 150°C; RGS = 1 MW Continuous Transient TC = 25°C TC = 25°C, Pulse width limited by TJM TC = 25°C TC = 25°C TC = 25°C IS £ IDM, di/dt £ 100 A/ms, VDD £ VDSS TJ £ 150°C, RG = 2 W TC = 25°C VDSS IXFR 30N50Q IXFR 32N50Q ID25 RDS(on) 0.16 W 0.15 W 500 V 29 A 500 V 30 A trr £ 250 ns Maximum Ratings 500 500 ±20 ±30 30N50 32N50 30N50 32N50 30N50 32N50 30 120 30 1.5 45 5 310 -55 ... +150 150 -55 ...
Published: |