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IXYS Corporation

GWM220-004P3 Datasheet Preview

GWM220-004P3 Datasheet

Three phase full bridge

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GWM 220-004P3
Three phase full bridge
with Trench MOSFETs
in DCB isolated high current package
VDSS = 40 V
RDSon = 2.0 m
ID25 = 190 A
Preliminary data
L+
G1
S1
G2
S2
L-
G3 G5
S3 S5
G4 G6
S4 S6
L1
L2
L3
MOSFETs
Symbol
VDSS
VGS
ID25
ID90
IF25
IF90
Conditions
TVJ = 25°C to 150°C
TC = 25°C
TC = 90°C
TC = 25°C (diode)
TC = 90°C (diode)
Maximum Ratings
40 V
±20 V
190 A
145 A
125 A
80 A
Symbol
R
DSon
VGSth
IDSS
IGSS
Qg
Q
gs
Qgd
td(on)
t
r
td(off)
t
f
VF
trr
RthJC
R
thJH
Conditions
Characteristic Values
(TVJ = 25°C, unless otherwise specified)
min. typ. max.
on chip level at
VGS = 10 V
TVJ = 25°C
TVJ = 125°C
VDS = 20 V; ID = 1 mA
VDS = VDSS; VGS = 0 V; TVJ = 25°C
TVJ = 125°C
VGS = ±20 V; VDS = 0 V
VGS= 10 V; VDS = 14 V; ID = 25 A
2.0 2.6 m
3.2 m
2 4V
1 µA
0.1 mA
0.2 µA
94 nC
18 nC
29 nC
VGS= 10 V; VDS = 30 V;
ID = 25 A; RG = 10
40 ns
85 ns
140 ns
90 ns
(diode) IF = 110 A; VGS= 0 V
(diode) IF = 20 A; -di/dt = 100 A/µs; VDS= 20 V
with heat transfer paste
1.0 1.6 V
70 ns
0.85 K/W
1.1 K/W
Applications
AC drives
• in automobiles
- electric power steering
- starter generator
• in industrial vehicles
- propulsion drives
- fork lift drives
• in battery supplied equipment
Features
• MOSFETs in trench technology:
- logic level gate control
- low RDSon
- optimized intrinsic reverse diode
• package:
- high level of integration
- high current capability
- auxiliary terminals for MOSFET control
- terminals for soldering or welding
connections
- isolated DCB ceramic base plate
with optimized heat transfer
IXYS reserves the right to change limits, test conditions and dimensions.
© 2005 IXYS All rights reserved
1-2




IXYS Corporation

GWM220-004P3 Datasheet Preview

GWM220-004P3 Datasheet

Three phase full bridge

No Preview Available !

GWM 220-004P3
Component
Symbol
I
RMS
TVJ
Tstg
VISOL
FC
Conditions
Maximum Ratings
per pin in main current paths (P+, N-, L1, L2, L3)
may be additionally limited by external connections
300 A
-40...+175
-55...+125
°C
°C
IISOL 1 mA; 50/60 Hz; t = 1 min
Mounting force with clip
1000
50 - 250
V~
N
Symbol
Conditions
Characteristic Values
(T
VJ
=
25°C,
unless
otherwise
specified)
min. typ. max.
Rpin to chip
CP
coupling capacity between shorted
pins and mounting tab in the case
0.6 m
160 pF
Weight
typ.
25 g
Dimensions in mm (1 mm = 0.0394")
Equivalent Circuits for Simulation
Thermal Response
junction - case (typ.)
Cth1 = 0.039 J/K; Rth1 = 0.28 K/W
Cth2 = 0.069 J/K; Rth2 = 0.57 K/W
© 2005 IXYS All rights reserved
2-2


Part Number GWM220-004P3
Description Three phase full bridge
Maker IXYS Corporation
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