IXGP30N60C2 - HiPerFAST IGBT C2- Class High Speed IGBTs

Features

z z z z Maximum lead temperature for soldering 1.6 mm (0.062 in. ) from case for 10 s Md Weight Mounting torque Very high frequency IGBT Square RBSOA High current handling capability MOS Gate turn-on - drive simplicity.

IXYS Corporation

Datasheet Details

Part number	IXGP30N60C2
Manufacturer	IXYS Corporation
File Size	575.94 KB
Description	HiPerFAST IGBT C2- Class High Speed IGBTs
Datasheet	IXGP30N60C2 Datasheet
Additional preview pages of the IXGP30N60C2 datasheet.

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Full PDF Text Transcription

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www.DataSheet4U.com HiPerFASTTM IGBT C2- Class High Speed IGBTs IXGP 30N60C2 VCES IC25 VCE(sat) tfi typ = 600 V = 70 A = 2.7 V = 32 ns Symbol VCES VCGR VGES VGEM IC25 IC110 ICM SSOA (RBSOA) PC TJ TJM Tstg Test Conditions TJ = 25°C to 150°C TJ = 25°C to 150°C; RGE = 1 MΩ Continuous Transient TC = 25°C (limited by leads) TC = 110°C TC = 25°C, 1 ms VGE = 15 V, TVJ = 125°C, RG = 10 Ω Clamped inductive load @ ≤ 600 V TC = 25°C Maximum Ratings 600 600 ±20 ±30 70 30 150 ICM = 60 190 -55 ... +150 150 -55 ... +150 300 V V V V A A A A W °C °C °C °C TO-220 (IXGP) G C E C (TAB) G = Gate, E = Emitter, C = Collector, TAB = Collector Features z z z z Maximum lead temperature for soldering 1.6 mm (0.062 in.

Published: Mar 25, 2010 |