l l l l Maximum lead temperature for soldering 1.6 mm (0.062 in.) from case for 10 s l International standard packages Low RDS (on) HDMOSTM process Rugged polysilicon .

l VDSS VGS(th) IGSS IDSS R DS(on) VGS = 0 V, ID = 250 µA VDS = VGS, ID = 250 µA VGS = ±20 VDC, VDS = 0 VDS = 0.8
*.

IXTH300N04T2

IXTH30N45

IXTH30N50

IXTH30N50L

IXTH30N50L2

IXTH30N50P

IXTH30N60L2

IXTH30N60P

IXTH32N65X

IXTH32P20T

IXTH340N04T4

IXTH34N65X2

IXTH36N50P

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