MUR850
Key Features
- Ultrafast Recovery Time
- Low Forward Voltage
- Low Leakage Current
- 175℃ Operating Junction Temperature
- High Temperature Glass Passivated Junction
- Minimum Lot-to-Lot variations for robust device performance and reliable operation MECHANICAL CHARACTERISTICS
- Case: Epoxy, Molded
- Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable
- Lead Temperature for Soldering Purposes: 260℃ Max. for 10 Seconds
