STPS60170CT Datasheet | Inchange Semiconductor

FEATURES - Guard -Ring for Stress Protection - Low Forward Voltage - High Operating Junction Temperature - Guaranteed Reverse Avalanche - Low Power Loss/High Efficiency - High surge capability - Low Stored Charge Majority Carrier Conduction - Minimum Lot-to-Lot variations for robust device performance and reliable operation MECHANICAL CHARACTERISTICS - Case: Epoxy, Molded - Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable - Lead Temperature for Soldering Purposes: 260℃ Max. for 10 Seconds ABSOLUTE MAXIMUM RATINGS(Ta=25℃) SYMBOL PARAMETER VRRM IF(AV) IFSM Peak Repetitive Reverse Voltage Average Rectified Forward Current Nonrepetitive Peak Surge Current Junction Temperature Tstg Storage Temperature Range dv/dt Voltage Rate of Change (Rated VR) THERMAL CHARACTERISTICS SYMBOL PARAMETER Rth j-c Thermal Resistance,Junction to Case VALUE UNIT -65~175 ℃ -65~175 ℃ 10,000 V/μs MAX 1.0 UNIT ℃/W isc website：.iscsemi. 1 isc & iscsemi is registered trademark Schottky Barrier Rectifier ELECTRICAL CHARACTERISTICS (Pulse Test: Pulse Width=300μs,Duty...