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Infineon Technologies Electronic Components Datasheet

BSC079N03LSCG Datasheet

Power-Transistor

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OptiMOS™3 Power-MOSFET
Features
• Fast switching MOSFET for SMPS
• Optimized technology for DC/DC converters
• Improved switching behaviour
• Qualified according to JEDEC1) for target applications
• N-channel; Logic level
• Excellent gate charge x R DS(on) product (FOM)
• Very low on-resistance R DS(on)
• Superior thermal resistance
• Avalanche rated
• Pb-free plating; RoHS compliant
• Halogen-free according to IEC61249-2-21
BSC079N03LSC G
Product Summary
V DS
R DS(on),max
ID
30 V
7.9 m
50 A
PG-TDSON-8
Type
BSC079N03LSC G
Package
PG-TDSON-8
Marking
079N03LS
Maximum ratings, at T j=25 °C, unless otherwise specified
Parameter
Symbol Conditions
Continuous drain current
I D V GS=10 V, T C=25 °C
V GS=10 V, T C=100 °C
Pulsed drain current3)
Avalanche current, single pulse4)
Avalanche energy, single pulse
Gate source voltage
1) J-STD20 and JESD22
V GS=4.5 V, T C=25 °C
V GS=4.5 V,
T C=100 °C
V GS=10 V, T A=25 °C,
R thJA=50 K/W2)
I D,pulse
I AS
E AS
V GS
T C=25 °C
T C=25 °C
I D=30 A, R GS=25
Value
50
32
39
25
14
200
35
10
±20
Unit
A
mJ
V
Rev. 2.2
page 1
2009-10-23


Infineon Technologies Electronic Components Datasheet

BSC079N03LSCG Datasheet

Power-Transistor

No Preview Available !

Maximum ratings, at T j=25 °C, unless otherwise specified
Parameter
Symbol Conditions
Power dissipation
P tot T C=25 °C
T A=25 °C,
R thJA=50 K/W2)
Operating and storage temperature T j, T stg
IEC climatic category; DIN IEC 68-1
BSC079N03LSC G
Value
30
2.5
-55 ... 150
55/150/56
Unit
W
°C
Parameter
Symbol Conditions
min.
Values
typ.
Unit
max.
Thermal characteristics
Thermal resistance, junction - case
R thJC
Device on PCB
R thJA
bottom
top
6 cm2 cooling area2)
-
-
-
- 4.1 K/W
- 20
- 50
Electrical characteristics, at T j=25 °C, unless otherwise specified
Static characteristics
Drain-source breakdown voltage
V (BR)DSS V GS=0 V, I D=1 mA
30
-
-V
Gate threshold voltage
V GS(th) V DS=V GS, I D=250 µA
1
- 2.2
Zero gate voltage drain current
I DSS
V DS=30 V, V GS=0 V,
T j=25 °C
-
0.1
1 µA
V DS=30 V, V GS=0 V,
T j=125 °C
-
10 100
Gate-source leakage current
Drain-source on-state resistance
Gate resistance
I GSS
R DS(on)
RG
V GS=20 V, V DS=0 V
V GS=4.5 V, I D=30 A
V GS=10 V, I D=30 A
- 10 100 nA
- 10.2 12.7 m
- 6.6 7.9
- 3.0 -
Transconductance
g fs
|V DS|>2|I D|R DS(on)max,
I D=30 A
28
55
-S
2) Device on 40 mm x 40 mm x 1.5 mm epoxy PCB FR4 with 6 cm2 (one layer, 70 µm thick) copper area for drain
connection. PCB is vertical in still air.
3) See figure 3 for more detailed information
Rev. 2.2
page 2
2009-10-23


Part Number BSC079N03LSCG
Description Power-Transistor
Maker Infineon
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