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DF4-19MR20W3M1HF_B11
EasyPACK™ module
EasyPACK™ module with CoolSiC™ Trench MOSFET and PressFIT / NTC
Features • Electrical features
- VDSS = 2000 V - IDN = 60 A / IDRM = 120 A - High current density - Low inductive design • Mechanical features - Rugged mounting due to integrated mounting clamps - PressFIT contact technology - Integrated NTC temperature sensor Potential applications • Solar applications Product validation • Qualified for industrial applications according to the relevant tests of IEC 60747, 60749 and 60068 Description
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Datasheet www.infineon.com
Please read the sections "Important notice" and "Warnings" at the end of this document
Revision 1.00 2022-07-15
DF4-19MR20W3M1HF_B11
EasyPACK™ module
Table of contents
Table of contents
Description . . . . . . . . . . . .