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Infineon Technologies Electronic Components Datasheet

PG-LQFP-64-22 Datasheet

Package Outline

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P/PG-LQFP-64-6, -8, -12, -19, -22
Package Outline
15 x 0.5 = 7.5
H
0.5
0.2
+0.07
-0.03
C 0.08 C 64x
SEATING COPLANARITY
PLANE
0.08 M A-B D C 64x
0.5 x 45°
12
10 1)
D
0.2 A-B D 64x
0.2 A-B D H 4x
AB
0.6 ±0.15
Bottom View
Ex
Ox
Exposed Diepad
64
1
Index Marking
64
1
Index Marking
1) Does not include plastic or metal protrusion of 0.25 max. per side
Exposed Diepad Dimensions
Package
Leadframe
Ex Ey Ox Oy
PG-LQFP-64-8
C66065-A6866-C005 5 5 0 0
PG-LQFP-64-6
C66065-A6866-C013 5.6 5.6 0 0
PG-LQFP-64-12
C66065-A6866-C018 4 4 0 0
PG-LQFP-64-6, -22 C66065-A6866-C019 5.4 5.4 0 0
PG-LQFP-64-19
C66065-A6866-C020 5.8 5.8 0 0
Foot Print
Soldering Type: Reflow Soldering
0.5
1.35
Package Information
Ex
0.29
11.45
Thermal Pad
Published by Infineon Technologies AG
http://www.Datasheet4U.com


Infineon Technologies Electronic Components Datasheet

PG-LQFP-64-22 Datasheet

Package Outline

No Preview Available !

P/PG-LQFP-64-6, -8, -12, -19, -22
Marking Layout
Manufacturer
Pin 1 Marking
Assembly site code
(E for Infineon mal)
Tape and Reel
Reel ø330 mm: 1.900 Pieces/Reel
Reels/Box:
1
Index
Marking
123456789
123456789
123456789
XXXXXXXXXXX
EMC
16
Type code
Date code (YYWW)
G = Green Product
Moulding compound code
0.3
Bakable Tray
Pieces/Tray: 160
Trays/Box: 1; 6
12.35
1.55
2.05
315
13.1
15.2
Mark for Pin 1
Package Information
Published by Infineon Technologies AG
http://www.Datasheet4U.com


Part Number PG-LQFP-64-22
Description Package Outline
Maker Infineon
Total Page 2 Pages
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