Datasheet Summary
P/PG-LQFP-64-4, -5, -13
Package Outline
1.6 MAX.
1.4 ±0.05
0.1 ±0.05
0.15 -0.06
+0.05
+0.07
H 0.6 ±0.15 0.2 -0.03
0.5 7.5 C 0.08 C 64x
0.08 M A-B D C 64x
12 10
1)
0.2 A-B D 64x 0.2 A-B D H 4x
1)
Index Marking 1) Does not include plastic or metal protrusion of 0.25 max. per side
Foot Print
Soldering Type: Reflow Soldering
Package Information
Published by Infineon Tec hnologies AG
7° MAX. http://..
P/PG-LQFP-64-4, -5, -13
Marking Layout
Type code
Manufacturer
Pin 1 Marking
123456789 123456789 12345678901 XXXXXXXX XXX
Date code (YYWW) G = Green Product Mother lot number Split lot...