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ROK104001 Datasheet

Bluetooth MULTI CHIP MODULE

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PRODUCT BRIEF
BluetoothTM
Multi Chip Module
Description
The Bluetooth MCM Solution ROK104001 from
Infineon Technologies is a complete solution for fast
implementation, and cuts your time-to-market.
It is a short-range, compact and cost effective radio-
baseband module that supports both voice and data
transmission and can be implemented in any
electronic device. The module includes a baseband
processor with 4 Mbit Flash memory, a radio solution,
antenna interfaces and application supporting circuitry.
The ROK 104 001 comes with either the Embedded
Communication Platform (ECP) firmware, providing
the full Bluetooth software stack, including profiles for
serial communication, or with the basic Bluetooth firm-
ware for signaling at the HCI (Host Controller Inter-
face) level.
Since this solution is also FCC and ETSI type
approved on delivery, cost and time for qualification
and type approval is greatly minimized.
Key Features
s A small and cost effective Bluetooth system
s Output power class 2
s Complete Bluetooth function including:
- Hardware: Radio, Baseband, Crystal & Memory,
Voltage regulator and RC filters
Bluetooth
-Firmware in two versions:
-a) Serial Communication (GAP/SPP/DUN/LAN)
-b) HCI : Standard Bluetooth Interface
s Point- to -Multipoint, 7 slaves with the HCI firmware or
3 slaves with embedded stack
s Power management: PARK, SNIFF & HOLD as well
as system power saving
s Pre-qualified for Bluetooth spec. 1.1
s FCC & ETSI type approved
s Multiple interfaces UART, PCM, Bidirectional serial
interface/GPIO, GPIO
s Voltage regulator included on module highly reduces
the input voltage requirements
Note: The Bluetooth trademarks are owned by Bluetoth SIG, Inc. and used
by Infineon Technologies under license.
www.infineon.com/bluetooth
ROK 104 001
Multi Chip Module
Never stop thinking.


Infineon Technologies Electronic Components Datasheet

ROK104001 Datasheet

Bluetooth MULTI CHIP MODULE

No Preview Available !

Configuration
ROK 104 001
Debug
Interface
8-bit
GPIO
Bluetooth
Core
AMBATM BusSystem
UART1 UART2 PCM Memory
UART1 (921 kbit/s) UART2 (921 kbit/s)
PRODUCT BRIEF
ECP - Firmware
Host
Serial Communication
Host Application
ECI Driver
Networking
Host Application
ECI Driver
Serial Media - UART
Serial Media - UART
ROK
104 001
ECI
RFCOMMSDP
L2CAP
LM
ECI
PAN SDAP
BNEP SDP
L2CAP
LM
Antenna Interface
50 Ohm Bluetooth ISM band antenna (2.4 – 2.5 GHz).
Module Size
The dimensions of the Bluetooth module are:
15.5 x 10.5 x 2.0 mm.
UART’s
s UART1 supports band rates up to 921 kbit/s with
maximum throughput.
s UART2 supports baud rates up to 921 kbit/s with
reduced throughput.
PCM
s The PCM interface provides full support for one
PCM channel to facilitate voice communication.
Bidirectional Serial Interface/GPIO
s For example PCM codecs or EEPROM.
GPIO
s An 8 bit programmable General Purpose IO inter-
face
.
Host
Host
Traditional host stack
Traditional host stack
Host application
Host application
API
API
RFCOMM SDP
RFCOMM SDP
L2CAP
L2CAP
HCI
HCI
Serial Media - UART
Serial Media - UART
ROK
R10O4K001
104 001
HCI
HLMCI
LM
Ordering Information
ROK 104 001/21 : With standard HCI firmware
ROK 104 001/22 : With ECP firmware (Serial)
How to reach us:
http://www.infineon.com
Published by
Infineon Technologies AG,
St.-Martin-Strasse 53,
81541 München
© Infineon Technologies AG 2002. All Rights Reserved.
Attention please!
The information herein is given to describe certain components
and shall not be considered as warranted characteristics.
Terms of delivery and rights to technical change reserved.
We hereby disclaim any and all warranties, including but not
limited to warranties of non-infringement, regarding circuits,
descriptions and charts stated herein.
Infineon Technologies is an approved CECC manufacturer.
Information
For further information on technology, delivery terms
and conditions and prices please contact your nearest
Infineon Technologies Office in Germany or our Infineon
Technologies Representatives worldwide.
Published by Infineon Technologies AG
Warnings
Due to technical requirements components may contain dan-
gerous substances. For information on the types in question
please contact your nearest Infineon Technologies Office.
Infineon Technologies Components may only be used in life-
support devices or systems with the express written approval
of Infineon Technologies, if a failure of such components can
reasonably be expected to cause the failure of that life-support
device or system, or to affect the safety or effectiveness of that
device or system. Life support devices or systems are intend-
ed to be implanted in the human body, or to support and/or
maintain and sustain and/or protect human life. If they fail, it is
reasonable to assume that the health of the user or other per-
sons may be endangered.
Ordering No. B134-H8137-X-X-7600
Printed in Germany
PS 02023.
NB


Part Number ROK104001
Description Bluetooth MULTI CHIP MODULE
Maker Infineon
Total Page 2 Pages
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