• Part: LGM470
  • Manufacturer: Infineon
  • Size: 181.79 KB
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LGM470 Description

Mini TOPLED RG through-hole .. LG M470 Vorläufige Daten / Preliminary Data Besondere Merkmale Gehäusetyp: weißes SMT-Gehäuse Besonderheit des Bauteils:.

LGM470 Key Features

  • package: white SMT package
  • feature of the device: extremely wide viewing angle; LED is mounted top down and emits through the PCB; ideal for backli
  • wavelength: 570 nm
  • viewing angle: Lambertian Emitter (120°)
  • technology: GaP
  • optical efficiency: 2.5 lm/W
  • grouping parameter: luminous intensity
  • assembly methods: suitable for all SMT assembly methods
  • soldering methods: IR reflow soldering
  • preconditioning: acc. to JEDEC Level 2