SIDC81D120E6 Datasheet | Infineon

.. Preliminary Fast switching diode chip in EMCON-Technology Features : - 1200V EMCON technology 130 µm chip - soft, fast switching - low reverse recovery charge - small temperature coefficient This chip is used for: - EUPEC power modules and discrete devices Applications: - SMPS, resonant applications, drives Chip Type Die Size 9 x 9 mm2 Package sawn on foil Ordering Code Q67050-A4128A001 1200V 100A MECHANICAL PARAMETER: Raster size Area total / active Anode pad size Thickness Wafer size Flat position Max. possible chips per wafer Passivation frontside Anode metallisation Cathode metallisation Die bond Wire bond Reject Ink...