SIGC158T120R3 Datasheet | Infineon

.. IGBT Chip Features : - 1200V Trench + Field Stop technology - low turn-off losses - short tail current - positive temperature coefficient - easy paralleling This chip is used for: - power module Applications: - drives Chip Type SIGC158T120R3 ICn Die Size 12.56 x 12.56 mm2 Package sawn on foil Ordering Code Q67050A4109-A001 1200V 150A MECHANICAL PARAMETER: Raster size Emitter pad size Gate pad size Area total / active Thickness Wafer size Flat position Max.possible chips per wafer Passivation frontside Emitter metallization Collector metallization Die bond Wire bond Reject Ink Dot Size Remended Storage Environment 12.56 x 12.56...