SIGC158T120R3L
SIGC158T120R3L is IGBT manufactured by Infineon.
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IGBT Chip
Features
:
- 1200V Trench + Field Stop technology
- 120µm chip
- low turn-off losses
- short tail current
- positive temperature coefficient
- easy paralleling
This chip is used for:
- power module
Applications:
- drives
Chip Type SIGC158T120R3L
ICn
Die Size 12.56 x 12.56 mm2
Package sawn on foil
Ordering Code Q67050A4211-A101
1200V 150A
MECHANICAL PARAMETER: Raster size Emitter pad size ( include gate pad ) Gate pad size Area total / active Thickness Wafer size Flat position Max.possible chips per wafer Passivation frontside Emitter metallization Collector metallization Die bond Wire bond Reject Ink Dot Size Remended...
