SIGC76T60R3 Datasheet | Infineon

.. IGBT Chip Features : - 600V Trench & Field Stop technology - low VCE(sat) - low turn-off losses - short tail current - positive temperature coefficient - easy paralleling This chip is used for: - power module Applications: - drives Chip Type SIGC76T60R3 VCE 600V ICn 150A Die Size 7.87 x 9.69 mm2 Package sawn on foil Ordering Code Q67050A4343-A101 MECHANICAL PARAMETER: Raster size Emitter pad size Gate pad size Area total / active Thickness Wafer size Flat position Max. possible chips per wafer Passivation frontside Emitter metallization Collector metallization Die bond Wire bond Reject ink dot size Remended storage environment 7.87 x...