28F008C3 Datasheet | Intel

E n n n PRODUCT PREVIEW 3 VOLT ADVANCED+ BOOT BLOCK 8-, 16-, 32-MBIT FLASH MEMORY FAMILY 28F008C3, 28F016C3, 28F032C3 28F800C3, 28F160C3, 28F320C3 Flexible Smart Voltage Technology  2.7 V- 3.6 V Read/Program/Erase  2.7 V or 1.65 V I/O Option Reduces Overall System Power  12 V for Fast Production Programming High Performance  2.7 V- 3.6 V: 90 ns Max Access Time  3.0 V- 3.6 V: 80 ns Max Access Time Optimized Architecture for Code Plus Data Storage  Eight 8-Kbyte Blocks, Top or Bottom Locations  Up to Sixty-Three 64-KB Blocks  Fast Program Suspend Capability  Fast Erase Suspend Capability Flexible Block Locking  Lock/Unlock Any Block  Full Protection on Power-Up  WP# Pin for Hardware Block Protection  VPP = GND Option  VCC Lockout Voltage Low Power Consumption  9 m A Typical Read Power  10 µA Typical Standby Power with Automatic Power Savings Feature Extended Temperature Operation  - 40 °C to +85 °C n n n n Easy-12 V  Faster Production Programming  No Additional System Logic 128-bit Protection Register  64-bit Unique Device Identifier  64-bit User Programmable OTP Cells Extended Cycling Capability  Minimum 100,000 Block Erase Cycles Flash Data Integrator Software  Flash Memory Manager  System Interrupt Manager  Supports Parameter Storage, Streaming Data (e.g., voice) Automated Word/Byte Program and Block Erase  mand User Interface  Status Registers SRAM-patible Write Interface Cross-patible mand Support  Intel Basic mand Set  mon Flash Interface x 16 for High Performance  48-Ball µBGA- Package  48-Lead TSOP Package x 8 I/O for Space Savings  48-Ball µBGA- Package  40-Lead TSOP Package 0.25 µ ETOX™ VI Flash Technology n n n n n n n n n The 0.25 µm 3 Volt Advanced+ Boot Block, manufactured on Intel’s latest 0.25 µ technology, represents a feature-rich solution at overall lower system cost. Smart 3 flash memory devices incorporate low voltage capability (2.7 V read, program and erase) with high-speed, low-power...