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DPA6119 - Power IC Relay

Download the DPA6119 datasheet PDF. This datasheet also covers the DPA6111 variant, as both devices belong to the same power ic relay family and are provided as variant models within a single manufacturer datasheet.

Description

The DPA Series ChipSwitch uses exclusive International Rectifier S3X power integrated circuit technology to form a fully functioning solid-state relay.

Features

  • S3X power IC chips n 25 Amp surge n 4,000 VRMS I/O isolation n 10 µA off-state leakage current n Zero-voltage turn-on n Operates without snubber n 600 V/µs off-state dv/dt n Solid-State reliability n UL recognized and CSA certified n Part Identification Part Number DPA4111 DPA4119 DPA6111 DPA6119 Transient Overvoltage (V PEAK) 400 400 600 600 Operating Voltage (VRMS) 20-140 20-140 20-280 20-280 DC Input Sensitivity (Turn-On) 10mA 3.5V 10mA 3.5V (ChipSwitch and HEXFET are trademarks of Internat.

📥 Download Datasheet

Note: The manufacturer provides a single datasheet file (DPA6111_InternationalRectifier.pdf) that lists specifications for multiple related part numbers.

📁 Similar Datasheet

Part Number Description Manufacturer
DPA6119 Power IC Relay Crydom
DPA6111 Power IC Relay Crydom
DPA4111 Power IC Relay Crydom
DPA4119 Power IC Relay Crydom
DPA422 Highly Integrated DC-DC Converter Power Integrations

Other Datasheets by International Rectifier (now Infineon)

Part Number Description
DPA6111 Power IC Relay
DPA4111 Power IC Relay
DPA4119 Power IC Relay

Full PDF Text Transcription (Reference)

The following content is an automatically extracted verbatim text from the original manufacturer datasheet and is provided for reference purposes only.

View original datasheet text
PD 1.033A DPA Series ChipSwitch® DIP Relay Microelectronic Power IC Relay 1.0 Amp Load Current, 20 - 280 VACRMS General Description The DPA Series ChipSwitch uses exclusive International Rectifier S3X power integrated circuit technology to form a fully functioning solid-state relay. The S3X technology combines MOS and bipolar processes, derived from IR’s HEXFET® power MOSFET designs, to eliminate the need for both discrete components and hybrid circuits. The basic DPA Series ChipSwitch consists of two identical power integrated circuits connected in inverse parallel (analogous to back-to-back SCRs) for AC control plus an isolated GaAIAs light emitting diode (LED) for actuation. Voltage controlled models with an internal resistor to limit the control current are also available.
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