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GB50XF120K - IGBT SIXPACK MODULE

Key Features

  • • • • • • Low VCE (on) Non Punch Through IGBT Technology Low Diode VF 10µs Short Circuit Capability Square RBSOA.

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www.DataSheet.co.kr Bulletin PD - 94567 rev.B 08/03 GB50XF120K IGBT SIXPACK MODULE Features • • • • • Low VCE (on) Non Punch Through IGBT Technology Low Diode VF 10µs Short Circuit Capability Square RBSOA HEXFRED Antiparallel Diode with Ultrasoft Reverse Recovery Characteristics • Positive VCE (on) Temperature Coefficient • Ceramic DBC Substrate • Low Stray Inductance Design VCES = 1200V IC = 50A @ TC=80°C tsc > 10µs @ TJ=150°C ECONO2 6PACK VCE(on) typ. = 2.