Datasheet Details
| Part number | HF05D060ACE |
|---|---|
| Manufacturer | International Rectifier |
| File Size | 97.89 KB |
| Description | Hexfred Die |
| Datasheet |
 HF05D060ACE Datasheet
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| Part number | HF05D060ACE |
|---|---|
| Manufacturer | International Rectifier |
| File Size | 97.89 KB |
| Description | Hexfred Die |
| Datasheet |
HF05D060ACE Datasheet
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Guaranteed (min, max) Test Conditions VF Forward Voltage Drop BVR Reverse Breakdown Voltage IRM Reverse Leakage Current 0.8V min, 1.05V max 600V min 10µA max IC = 1A, TJ = 25°C TJ = 25°C, IR = 1mA TJ = 25°C, VR = 600V Mechanical Data Nominal Backmetal Composition, (Thickness) Cr (0.1µm)- NiV (0.2µm) - Ag (0.25µm) Nominal Front Metal Composition, (Thickness) 99% Al/1% Si, (3µm) Dimensions 0.075'' x 0.076" Wafer Diameter 150mm, with std.< 100 > flat Wafer Thickness, Tolerance 376µ
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