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International Rectifier Electronic Components Datasheet

HFA75MB40C Datasheet

Ultrafast/ Soft Recovery Diode HEXFRED

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PD -2.475A
HFA75MB40C
HEXFREDTM
Ultrafast, Soft Recovery Diode
Features
• Reduced RFI and EMI
• Reduced Snubbing
• Extensive Characterization of Recovery Parameters
(ISOLATED BASE)
(1-3) (4-6) (7-9)
ANODE COMMON ANODE
1 CATHODE
2
VR = 400V
VF(typ.)ƒ = 1V
IF(AV) = 75A
Qrr (typ.) = 200nC
IRRM(typ.) = 6A
trr(typ.) = 30ns
di(rec)M/dt (typ.)ƒ = 190A/µs
Description
HEXFREDTMdiodes are optimized to reduce losses and EMI/RFI in high frequency
power conditioning systems. An extensive characterization of the recovery
behavior for different values of current, temperature and di/dt simplifies the
calculations of losses in the operating conditions. The softness of the recovery
eliminates the need for a snubber in most applications. These devices are
ideally suited for power converters, motors drives and other applications where
switching losses are significant portion of the total losses.
Absolute Maximum Ratings (per Leg)
D-60
A
(MODIFIED T0-249AA)
Parameter
VR
IF @ TC = 25°C
IF @ TC = 100°C
IFSM
IAS
EAS
PD @ TC = 25°C
PD @ TC = 100°C
TJ
TSTG
Cathode-to-Anode Voltage
Continuous Forward Current
Continuous Forward Current
Single Pulse Forward Current 
Maximum Single Pulse Avalanche Current ‚
Non-Repetitive Avalanche Energy ‚
Maximum Power Dissipation
Maximum Power Dissipation
Operating Junction and
Storage Temperature Range
Soldering Temperature, for 10 sec.
Thermal - Mechanical Characteristics
RθJC
RθCS
Wt
Parameter
Junction-to-Case, Single Leg Conducting
Junction-to-Case, Both Legs Conducting
Case-to-Sink, Flat, Greased Surface
Weight
Mounting Torque
Note:  Limited by junction temperature
‚ L = 100µH, duty cycle limited by max TJ
ƒ 125°C
Max.
400
75
36
300
5.0
1.4
125
50
-55 to +150
300 (0.063 in. (1.6mm) from case)
Min.
––––
––––
––––
––––
35 (4.0)
Typ.
––––
––––
0.10
58 (2.0)
––––
Max.
1.0
0.50
––––
––––
50 (5.7)
Units
V
A
mJ
W
°C
Units
°C/W
K/W
g (oz)
lbf•in
(N•m)
5/5/97


International Rectifier Electronic Components Datasheet

HFA75MB40C Datasheet

Ultrafast/ Soft Recovery Diode HEXFRED

No Preview Available !

HFA75MB40C
Electrical Characteristics (per Leg) @ TJ = 25°C (unless otherwise specified)
Parameter
Min. Typ. Max. Units
Test Conditions
VBR
Cathode Anode Breakdown Voltage
400 ––– ––– V IR = 100µA
VFM Max Forward Voltage
––– 1.1 1.3
IF = 35A
––– 1.3 1.5 V IF = 75A
See Fig. 1
IRM Max Reverse Leakage Current
CT Junction Capacitance
LS Series Inductance
––– 1.0 1.2
––– 0.50 3.0
––– 0.75 4.0
––– 90 125
––– 9.2 –––
IF = 35A, TJ = 125°C
µA VR = VR Rated
See Fig. 2
mA TJ = 125°C, VR = 320V
pF VR = 200V
See Fig. 3
nH Lead to lead 5mm from package body
Dynamic Recovery Characteristics (per Leg) @ TJ = 25°C (unless otherwise specified)
trr
trr1
trr2
IRRM1
IRRM2
Qrr1
Qrr2
d i(rec)M/dt1
d i(rec)M/dt2
Parameter
Reverse Recovery Time
Peak Recovery Current
Reverse Recovery Charge
Peak Rate of Fall of Recovery Current
During tb
Min. Typ. Max. Units
Test Conditions
––– 30 –––
IF = 1.0A, dif/dt = 200A/µs, VR = 30V
––– 67 100
––– 110 170
ns TJ = 25°C See Fig.
TJ = 125°C
5
IF = 35A
––– 6.0 11
––– 9.0 16
A TJ = 25°C See Fig.
TJ = 125°C
6
VR = 200V
––– 200 540 nC TJ = 25°C See Fig.
––– 500 1300
TJ = 125°C
7 dif/dt = 200A/µs
–––
–––
240
190
–––
–––
A/µs
TJ = 25°C
TJ = 125°C
See Fig.
8
6.60 (0.260)
6.10 (0.240)
50.80 (2.000)
REF.
4.95 (0.195)
DIA.
4.45 (0.175)
(4 PLCS.)
12.70 (0.500)
REF.
1
3.93 (0.155)
3.68 (0.145)
(8 PLCS.)
* PRE-SOLDER DIP DIMENSIONS
25.65 (1.010)
25.15 (0.990)
9
1.14 (0.045)
0.76 (0.030)
13.21 (0.520)
12.70 (0.500)
1.14 (0.045)
0.89 (0.035)
* (9 PLCS.)
1.14 (0.045) *
0.89 (0.035)
38.35 (1.510)
37.85 (1.490)
1.27 (0.050)
REF.
10.16 (0.400)
8.38 (0.330)
6.60 (0.260)
6.10 (0.240)
61.21 (2.410)
60.71 (2.390)
3.30 (0.130)
3.05 (0.120)
LEAD ASSIGNMENTS
1-3 ANODE
4-6 CATHODE
7-9 ANODE
BASE (ISOLATED)
A
Outline D-60 (Modfied JEDEC TO - 249AA)
Dimensions in millimeters and inches


Part Number HFA75MB40C
Description Ultrafast/ Soft Recovery Diode HEXFRED
Maker International Rectifier
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