IR0530CSP
Overview
International Rectifier's FlipKY product family utilizes wafer level chip scale packaging to deliver Schottky diodes with the lowest VF to PCB footprint area in industry. The three pad 0.9mm x 1.2mm devices can deliver up to 0.5A and occupy only 1.08mm2 of board space.
- Ultra Low VF To Footprint Area * *
- Very Low Profile (<0.6mm) Low Thermal Resistance Supplied Tested And On Tape & Reel
