IR0530CSP Datasheet | International Rectifier

Features - Ultra Low VF To Footprint Area - - - Very Low Profile (<0.6mm) Low Thermal Resistance Supplied Tested And On Tape & Reel Applications - Reverse Polarity Protection - - - - Current Steering Freewheeling Flyback Oring Flip KYTM Major Ratings and Characteristics Characteristics IF(AV) Rectangular waveform VRRM IFSM @ tp = 5 µs sine VF TJ @ 0.5 Apk, TJ=125°C range 0.5 30 190 0.33 - 55 to 150 Units A V A V °C Description International Rectifier's Flip KY product family utilizes wafer level chip scale packaging to deliver Schottky diodes with the lowest VF to PCB footprint area in industry. The three pad 0.9mm x 1.2mm devices can deliver up to 0.5A and occupy only 1.08mm2 of board space. The anode and cathode connections are made through solder bump pads on one side of the silicon rather than through protruding leads enabling designers to strategically place the diodes on the PCB. This design not only minimizes board space but also reduces thermal resistance and inductance, which can improve overall circuit efficiency. Typical applications include hand-held, portable equipment such as cell phones, MP3 players, PDAs, and portable hard disk drives where space savings and performance are crucial. .irf. Preliminary Data Sheet I0174J rev. A 06/05 Voltage Ratings Part number VR Max. DC Reverse Voltage (V) VRWM Max. Working Peak Reverse Voltage (V) Absolute Maximum Ratings .. Parameters Value 0.5 190 10 5 0.5 Units Conditions 50% duty cycle @ TPCB = 133 °C, rectangular wave form 5µs Sine or 3µs Rect. pulse 10ms Sine or 6ms Rect. pulse Following any rated load condition and with rated VRRM applied IF(AV) Max. Average Forward Current IFSM EAS IAR Max. Peak One Cycle Non-Repetitive Surge Current @ 25°C Non- Repetitive Avalanche Energy Repetitive Avalanche Current m J A TJ = 25 °C, IAS = 2.0A, L = 5.0m H Current decaying linearly to zero in 1 µsec Frequency limited by TJ max. Va = 1.5 x Vr typical Electrical...