IR0530CSP - FlipKY 0.5Amp

Description

International Rectifier's FlipKY product family utilizes wafer level chip scale packaging to deliver Schottky diodes with the lowest VF to PCB footprint area in industry.

The three pad 0.9mm x 1.2mm devices can deliver up to 0.5A and occupy only 1.08mm2 of board space.

Features

Ultra Low VF To Footprint Area.
Very Low Profile (.

International Rectifier (now Infineon)

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IR0530CSP FlipKY 0.5Amp by International Rectifier - Datasheet Preview — Datasheet preview – IR0530CSP

Datasheet Details

Part number	IR0530CSP
Manufacturer	International Rectifier (now Infineon)
File Size	189.69 KB
Description	FlipKY 0.5Amp
Datasheet	IR0530CSP Datasheet
Additional preview pages of the IR0530CSP datasheet.

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Full PDF Text Transcription

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Preliminary Data Sheet I0174J rev. A 06/05 IR0530CSP FlipKYTM 0.5 Amp 30 Volt www.DataSheet4U.com Features • Ultra Low VF To Footprint Area • • • Very Low Profile (<0.6mm) Low Thermal Resistance Supplied Tested And On Tape & Reel Applications • Reverse Polarity Protection • • • • Current Steering Freewheeling Flyback Oring FlipKYTM Major Ratings and Characteristics Characteristics IF(AV) Rectangular waveform VRRM IFSM @ tp = 5 µs sine VF TJ @ 0.5 Apk, TJ=125°C range IR0530CSP 0.5 30 190 0.33 - 55 to 150 Units A V A V °C Description International Rectifier's FlipKY product family utilizes wafer level chip scale packaging to deliver Schottky diodes with the lowest VF to PCB footprint area in industry. The three pad 0.9mm x 1.2mm devices can deliver up to 0.5A and occupy only 1.

Published: May 20, 2008 |