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International Rectifier Electronic Components Datasheet

IR2304 Datasheet

HALF-BRIDGE DRIVER

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Data Sheet No. PD60200 revB
IR2304(S) & (PbF)
Features
Floating channel designed for bootstrap operation
to +600V. Tolerant to negative transient voltage
dV/dt immune
Gate drive supply range from 10 to 20V
Under voltage lockout for both channels
3.3V, 5V, and 15V input logic input compatible
Cross-conduction prevention logic
Matched propagation delay for both channels
Lower di/dt gate driver for better noise immunity
Internal 100ns dead-time
Output in phase with input
Available in Lead-Free
HALF-BRIDGE DRIVER
Product Summary
VOFFSET
IO+/- (min)
VOUT
Delay Matching
Internal deadtime
ton/off (typ.)
Package
600V max.
60 mA/130 mA
10 - 20V
50 ns
100 ns
220/220 ns
Description
The IR2304(S) are a high voltage, high speed
power MOSFET and IGBT driver with inde-
pendent high and low side referenced output
channels. Proprietary HVIC and latch immune
CMOS technologies
enable ruggedized monolithic construction.
The logic input is compatible with standard
CMOS or LSTTL output, down to 3.3V logic.
The output driver features a high pulse cur-
rent buffer stage designed for minimum driver
cross-conduction. The floating channel can be
used to drive an N-channel power MOSFET
or IGBT in the high side configuration which
operates up to 600 volts.
8-Lead PDIP
8 Lead SOIC
2106/2301/2108/2109/2302/2304 Feature Comparison
Part
Input
logic
2106/2301
21064
2108
21084
2109/2302
21094
2304
HIN/LIN
HIN/LIN
IN/SD
HIN/LIN
Cross-
conduction
prevention
logic
no
yes
yes
yes
Dead-Time
none
Internal 540ns
Programmable 0.54~5µs
Internal 540ns
Programmable 0.54~5µs
Internal 100ns
Ground Pins
COM
VSS/COM
COM
VSS/COM
COM
VSS/COM
COM
Block Diagram
Vcc
up to 600V
HIN
LIN
VB
LIN
HIN
HO
VCC
VS
TO
LOAD
COM
LO
IR2304
www.irf.com
1


International Rectifier Electronic Components Datasheet

IR2304 Datasheet

HALF-BRIDGE DRIVER

No Preview Available !

IR2304(S)&(PbF)
Absolute Maximum Ratings
Absolute maximum ratings indicate sustained limits beyond which damage to the device may occur. All voltage param-
eters are absolute voltages referenced to COM, all currents are defined positive into any lead. The thermal resistance
and power dissipation ratings are measured under board mounted and still air conditions.
Symbol
VS
VB
VHO
VCC
VLO
VIN
Com
dVS/dt
PD
RthJA
TJ
TS
TL
Definition
High side offset voltage
High side floating supply voltage
High side floating output voltage HO
Low side and logic fixed supply voltage
Low side output voltage LO
Logic input voltage (HIN, LIN)
Logic ground
Allowable offset voltage SLEW RATE
Package power dissipation @ TA +25°C
Thermal resistance, junction to ambient
Junction temperature
Storage temperature
Lead temperature (soldering, 10 seconds)
8-Lead SOIC
8-Lead PDIP
8-Lead SOIC
8-Lead PDIP
Min.
VB - 25
-0.3
VS - 0.3
-0.3
-0.3
-0.3
VCC -25
-50
Max.
VB + 0.3
625
VB + 0.3
25
VCC + 0.3
VCC + 0.3
VCC + 0.3
50
0.625
1.0
200
125
150
150
300
Units
V
V/ns
W
°C/W
°C
Recommended Operating Conditions
The input/output logic timing diagram is shown in figure 1. For proper operation the device should be used within the
recommended conditions. The VS offset rating is tested with all supplies biased at 15V differential.
Symbol
Definition
Min.
Max. Units
VB
VS
VHO
VLO
VIN
VCC
TA
High side floating supply voltage
High side floating supply offset voltage
High side (HO) output voltage
Low side (LO) output voltage
Logic input voltage (HIN, LIN)
Low side supply voltage
Ambient temperature
VS + 10 VS + 20
Note 1
600
VS
VB
V
COM
VCC
COM
VCC
10
20
-40
125
°C
Note 1: Logic operational for VS of COM -5 to COM +600V. Logic state held for VS of COM -5V to COM -VBS.
2
www.irf.com


Part Number IR2304
Description HALF-BRIDGE DRIVER
Maker International Rectifier
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IR2304 Datasheet PDF






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