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IRF6618TR1 Datasheet HEXFET Power MOSFET

Manufacturer: International Rectifier (now Infineon)

Download the IRF6618TR1 datasheet PDF. This datasheet also includes the IRF6618 variant, as both parts are published together in a single manufacturer document.

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Note: The manufacturer provides a single datasheet file (IRF6618_InternationalRectifier.pdf) that lists specifications for multiple related part numbers.

General Description

The IRF6618 combines the latest HEXFET® Power MOSFET Silicon technology with the advanced DirectFETTM packaging to achieve the lowest on-state resistance in a package that has the footprint of an SO-8 and only 0.7 mm profile.

The DirectFET package is compatible with existing layout geometries used in power applications, PCB assembly equipment and vapor phase, infra-red or convection soldering techniques, when application note AN-1035 is followed regarding the manufacturing methods and processes.

The DirectFET package allows dual sided cooling to maximize thermal transfer in power systems, IMPROVING previous best thermal resistance by 80%.

Overview

PD - 94726D IRF6618/IRF6618TR1 HEXFET® Power MOSFET l Application Specific MOSFETs l Ideal for CPU Core DC-DC Converters l Low Conduction Losses l Low Switching Losses l Low Profile (<0.7 mm) l Dual Sided Cooling Compatible l Compatible with existing Surface Mount Techniques Applicable DirectFET Package/Layout Pad (see p.8,9 for details) VDSS 30V RDS(on) max 2.2mΩ@VGS = 10V 3.4mΩ@VGS = 4.