istics 10000 VGS = 0V, f = 1 MHZ Ciss = Cgs + Cgd, Cds SHORTED Crss = Cgd Coss = Cds + Cgd C, Capacitance(pF) 1000 Ciss Coss Crss 100 1 10 100 VDS, Drain-to-Sou.

PCB assembly equipment and vapor phase, infra-red or convection soldering techniques, when application note AN-1035 is .

The IRF6710S2TRPbF combines the latest HEXFET® Power MOSFET Silicon technology with the advanced DirectFETTM packaging to achieve improved performance in a package that has the footprint of a MICRO-8 and only 0.7 mm profile. The DirectFET package is .

IRF6710S2TR1PbF

IRF6710S2

IRF6711SPBF

IRF6711STRPBF

IRF6712SPBF

IRF6712STRPBF

IRF6713SPBF

IRF6713STRPBF

IRF6714MPbF

IRF6714MTRPbF

IRF6715MPbF

IRF6715MTRPbF

IRF6716MPBF