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IRK27 - ADD-A-pak-TM GEN V Power Modules

Download the IRK27 datasheet PDF. This datasheet also covers the IRK2-6 variant, as both devices belong to the same add-a-pak-tm gen v power modules family and are provided as variant models within a single manufacturer datasheet.

General Description

The Generation V of Add-A-pak module combine the excellent thermal performance obtained by the usage of Direct Bonded Copper substrate with superior mechanical ruggedness, thanks to the insertion of a solid Copper baseplate at the bottom side of the device.

Key Features

  • High Voltage Industrial Standard Package Thick Al metal die and double stick bonding Thick copper baseplate UL E78996 approved 3500VRMS isolating voltage ADD-A-pakTM GEN V Power Modules Benefits Up to 1600V Full compatible TO-240AA High Surge capability Easy Mounting on heatsink Al203 DBC insulator Heatsink grounded 27 A Mechanical.

📥 Download Datasheet

Note: The manufacturer provides a single datasheet file (IRK2-6_InternationalRectifier.pdf) that lists specifications for multiple related part numbers.

Full PDF Text Transcription for IRK27 (Reference)

Note: Below is a high-fidelity text extraction (approx. 800 characters) for IRK27. For precise diagrams, and layout, please refer to the original PDF.

www.DataSheet4U.com Bulletin I27130 rev. G 10/02 IRK.26 SERIES THYRISTOR/ DIODE and THYRISTOR/ THYRISTOR Features High Voltage Industrial Standard Package Thick Al metal ...

View more extracted text
STOR Features High Voltage Industrial Standard Package Thick Al metal die and double stick bonding Thick copper baseplate UL E78996 approved 3500VRMS isolating voltage ADD-A-pakTM GEN V Power Modules Benefits Up to 1600V Full compatible TO-240AA High Surge capability Easy Mounting on heatsink Al203 DBC insulator Heatsink grounded 27 A Mechanical Description The Generation V of Add-A-pak module combine the excellent thermal performance obtained by the usage of Direct Bonded Copper substrate with superior mechanical ruggedness, thanks to the insertion of a solid Copper baseplate at the bottom side of the device.