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IRKT57 - (IRKT41 - IRKT57) THYRISTOR/ DIODE and THYRISTOR/ THYRISTOR

Download the IRKT57 datasheet PDF. This datasheet also covers the IRKT56 variant, as both devices belong to the same (irkt41 - irkt57) thyristor/ diode and thyristor/ thyristor family and are provided as variant models within a single manufacturer datasheet.

Description

The Generation V of Add-A-pak module combine the excellent thermal performance obtained by the usage of Direct Bonded Copper substrate with superior mechanical ruggedness, thanks to the insertion of a solid Copper baseplate at the bottom side of the device.

Features

  • High Voltage Industrial Standard Package Thick Al metal die and double stick bonding Thick copper baseplate UL E78996 approved 3500VRMS isolating voltage ADD-A-pakTM GEN V Power Modules Benefits Up to 1600V Full compatible TO-240AA High Surge capability Easy Mounting on heatsink Al203 DBC insulator Heatsink grounded 45 A 60 A Mechanical.

📥 Download Datasheet

Note: The manufacturer provides a single datasheet file (IRKT56_InternationalRectifier.pdf) that lists specifications for multiple related part numbers.

📁 Similar Datasheet

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Other Datasheets by International Rectifier (now Infineon)

Part Number Description
IRKT500 SUPER MAGN-A-pak Power Modules
IRKT56 (IRKT41 - IRKT57) THYRISTOR/ DIODE and THYRISTOR/ THYRISTOR
IRKT105 ADD-A-pak GEN V Power Modules
IRKT136 (IRKT136/142/162) THYRISTOR/DIODE and THYRISTOR/THYRISTOR
IRKT142 (IRKT136/142/162) THYRISTOR/DIODE and THYRISTOR/THYRISTOR

Full PDF Text Transcription

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www.DataSheet4U.com Bulletin I27131 rev. G 10/02 IRK.41, .56 SERIES THYRISTOR/ DIODE and THYRISTOR/ THYRISTOR Features High Voltage Industrial Standard Package Thick Al metal die and double stick bonding Thick copper baseplate UL E78996 approved 3500VRMS isolating voltage ADD-A-pakTM GEN V Power Modules Benefits Up to 1600V Full compatible TO-240AA High Surge capability Easy Mounting on heatsink Al203 DBC insulator Heatsink grounded 45 A 60 A Mechanical Description The Generation V of Add-A-pak module combine the excellent thermal performance obtained by the usage of Direct Bonded Copper substrate with superior mechanical ruggedness, thanks to the insertion of a solid Copper baseplate at the bottom side of the device.
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