Description
l
IRL3103SPbF IRL3103LPbF
HEXFET® Power MOSFET
D
VDSS = 30V RDS(on) = 12mΩ
G S
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Absolute Maximum Ratings
ID @ TC = 25°C ID @ TC = 100°C IDM PD @TC = 25°C VGS IAR EAR dv/dt TJ TSTG
The D2Pak is a surface mount power package capable of accommodating die sizes up to HEX-4. It provides the highest power capability and the lowest possible onresistance in any existing surface mount package.The D2Pak is suitable for high current applications because of its low internal connect
Features
- 5%
[ ISD ].
- VGS = 5.0V for Logic Level and 3V Drive Devices Fig 14. For N-channel HEXFET® power MOSFETs
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7
IRL3103S/LPbF
D2Pak Package Outline
D2Pak Part Marking Information (Lead-Free)
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