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IRL3103SPBF - Power MOSFET

Download the IRL3103SPBF datasheet PDF. This datasheet also covers the IRL3103LPBF variant, as both devices belong to the same power mosfet family and are provided as variant models within a single manufacturer datasheet.

General Description

The D2Pak is a surface mount power package capable of accommodating die sizes up to HEX-4.

Key Features

  • 5% [ ISD ].
  • VGS = 5.0V for Logic Level and 3V Drive Devices Fig 14. For N-channel HEXFET® power MOSFETs www. irf. com 7 IRL3103S/LPbF D2Pak Package Outline D2Pak Part Marking Information (Lead-Free) T H IS IS AN IR F 5 30S WIT H L OT COD E 80 24 AS S E MB L E D ON WW 02 , 2 000 IN T H E AS S E MB L Y L IN E "L " N ote: "P " in as s embly line pos ition indicates "L ead-F ree" IN T E R N AT ION AL R E CT IF IE R L OGO AS S E MB L Y L OT COD E P AR T N U MB E R F 5 30 S D AT E.

📥 Download Datasheet

Note: The manufacturer provides a single datasheet file (IRL3103LPBF_InternationalRectifier.pdf) that lists specifications for multiple related part numbers.

Full PDF Text Transcription (Reference)

The following content is an automatically extracted verbatim text from the original manufacturer datasheet and is provided for reference purposes only.

View original datasheet text
PD - 95150 Advanced Process Technology l Surface Mount (IRL3103S) l Low-profile through-hole (IRL3103L) l 175°C Operating Temperature l Fast Switching l Fully Avalanche Rated l Lead-Free Description l IRL3103SPbF IRL3103LPbF HEXFET® Power MOSFET D VDSS = 30V RDS(on) = 12mΩ G S www.DataSheet4U.com Absolute Maximum Ratings ID @ TC = 25°C ID @ TC = 100°C IDM PD @TC = 25°C VGS IAR EAR dv/dt TJ TSTG The D2Pak is a surface mount power package capable of accommodating die sizes up to HEX-4. It provides the highest power capability and the lowest possible onresistance in any existing surface mount package. The D2Pak is suitable for high current applications because of its low internal connection resistance and can dissipate up to 2.0W in a typical surface mount application.