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InvenSense

ITG-3200 Datasheet Preview

ITG-3200 Datasheet

3-axis MEMS gyro IC

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InvenSense Inc.
1197 Borregas Ave, Sunnyvale, CA 94089 U.S.A.
Tel: +1 (408) 988-7339 Fax: +1 (408) 988-8104
Website: www.invensense.com
Document Number: PS-ITG-3200A-00
Revision: 1.7
Release Date: 08/02/2011
ITG-3200
Product Specification
Revision 1.7




InvenSense

ITG-3200 Datasheet Preview

ITG-3200 Datasheet

3-axis MEMS gyro IC

No Preview Available !

ITG-3200 Product Specification
Document Number: PS-ITG-3200A-00
Revision: 1.7
Release Date: 08/02/2011
CONTENTS
1 DOCUMENT INFORMATION.............................................................................................................................. 3
1.1 REVISION HISTORY ............................................................................................................................................. 3
1.2 PURPOSE AND SCOPE........................................................................................................................................... 5
1.3 PRODUCT OVERVIEW .......................................................................................................................................... 5
1.4 SOFTWARE SOLUTIONS........................................................................................................................................ 5
1.5 APPLICATIONS..................................................................................................................................................... 6
2 FEATURES............................................................................................................................................................... 7
3 ELECTRICAL CHARACTERISTICS .................................................................................................................. 8
3.1 SENSOR SPECIFICATIONS ..................................................................................................................................... 8
3.2 ELECTRICAL SPECIFICATIONS.............................................................................................................................. 9
3.3 ELECTRICAL SPECIFICATIONS, CONTINUED ........................................................................................................10
3.4 ELECTRICAL SPECIFICATIONS, CONTINUED ........................................................................................................11
3.5 I2C TIMING CHARACTERIZATION........................................................................................................................12
3.6 ABSOLUTE MAXIMUM RATINGS.........................................................................................................................13
4 APPLICATIONS INFORMATION ......................................................................................................................14
4.1 PIN OUT AND SIGNAL DESCRIPTION ...................................................................................................................14
4.2 TYPICAL OPERATING CIRCUIT............................................................................................................................15
4.3 BILL OF MATERIALS FOR EXTERNAL COMPONENTS ...........................................................................................15
4.4 RECOMMENDED POWER-ON PROCEDURE...........................................................................................................16
5 FUNCTIONAL OVERVIEW.................................................................................................................................17
5.1 BLOCK DIAGRAM ...............................................................................................................................................17
5.2 OVERVIEW .........................................................................................................................................................17
5.3 THREE-AXIS MEMS GYROSCOPE WITH 16-BIT ADCS AND SIGNAL CONDITIONING..........................................17
5.4 I2C SERIAL COMMUNICATIONS INTERFACE ........................................................................................................18
5.5 CLOCKING ..........................................................................................................................................................18
5.6 SENSOR DATA REGISTERS ..................................................................................................................................18
5.7 INTERRUPTS .......................................................................................................................................................18
5.8 DIGITAL-OUTPUT TEMPERATURE SENSOR .........................................................................................................18
5.9 BIAS AND LDO...................................................................................................................................................18
5.10 CHARGE PUMP ...................................................................................................................................................18
6 DIGITAL INTERFACE .........................................................................................................................................19
6.1 I2C SERIAL INTERFACE.......................................................................................................................................19
7 ASSEMBLY .............................................................................................................................................................23
7.1 ORIENTATION.....................................................................................................................................................23
7.2 PACKAGE DIMENSIONS.......................................................................................................................................24
7.3 PCB DESIGN GUIDELINES: .................................................................................................................................25
7.4 ASSEMBLY PRECAUTIONS ..................................................................................................................................26
7.5 PACKAGE MARKING SPECIFICATION ..................................................................................................................29
7.6 TAPE & REEL SPECIFICATION.............................................................................................................................30
7.7 LABEL ................................................................................................................................................................31
7.8 PACKAGING........................................................................................................................................................32
8 RELIABILITY ........................................................................................................................................................33
8.1 QUALIFICATION TEST POLICY ............................................................................................................................33
8.2 QUALIFICATION TEST PLAN ...............................................................................................................................33
9 ENVIRONMENTAL COMPLIANCE ..................................................................................................................34
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Part Number ITG-3200
Description 3-axis MEMS gyro IC
Maker InvenSense
Total Page 30 Pages
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