FI-XBD7S-HF10
Features
- patible with high-speed differential transmission and high-level impedance matching (90 to 100Ω)
- Drastically improved grounding which is directly related to EMI characteristics.
- 1.5mm connector height and 1mm height above the PCB thanks to bottom type structure.
- 1mm contact pitch with impedance matching.
- patible with FPC and cable by mon use of board header.
Enables stable grounding to the PCB thanks to FPC relay used in other FI Series connectors.
General Specifications
- No. of contacts: 14, 20, 30 (all signal) D7 (only for differential transmission)
- Applicable FPC: t0.14±0.03
- Applicable cable: AWG #30 to #40
- Operating temperature: -40°C to +80°C
- Contact resistance: Less than 40mΩ
- Rated current: 1A per pin for both AC and DC
- Rated voltage: 200V per pin for both AC and DC
- Insulation resistance: Greater than 100MΩ
- Withstand voltage: AC500Vr.m.s. for 1 minute
- Pitch: 1mm
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MB-0014-7
Connector bination
- No. of contacts D7 differential 7pairs...
