FTB8F-20 Description
1 Input Pin（~） 2 Input Pin（~） 3 Output Anode（+） 4 Output Cathode（-） Case: Solderable per MIL-STD-750, Method 2026 Approx. 82mg 0.0029oz 3 4 2 1 ABF Package Maximum Ratings and Ratings at 25 °C ambient temperature unless otherwise specified.
FTB8F-20 Key Features
- Glass Passivated Chip Junction
- Reverse Voltage
- 100 to 1000 V
- Forward Current
- Fast reverse recovery time
- Designed for Surface Mount Application
- Case: ABF
- Terminals: Solderable per MIL-STD-750, Method 2026
- Approx. Weight: 82mg 0.0029oz